22 Oct 2019

Internship Product Engineering Intern

HP – Posted by acsgetexperience Corvallis, Oregon, United States

Job Description

The MEMS section from the Advanced Technology Platforms & Solutions in Corvallis, Oregon is looking for a Silicon Product Engineering Intern.  HP’s Advanced Technology and Platform Solutions department is part of an R&D product development team, developing market leading printing solutions.  This intern will work closely with printer development engineers, circuit designers, test engineers and process engineers to complete a project (or projects) related to product development.

Required:

  • Develop fundamental understanding of fabrication processes and product development methodologies
  • Work with a team of engineers and technicians to complete assigned project
  • Document and present project methods and results.

Qualifications:

  • 3rd year of university completed.
  • Actively Pursuing Bachelor’s or Master’s Degree in Material Science, Engineering (ChE, EE, Microelectronics, Microsystems), or Physical Sciences (Chemistry, Physics) with a research topic related to silicon or MEMS processing.
  • Ability to work and interact effectively with team members from other disciplines, cultures, organizations and other companies both locally and remotely.
  • Understanding of the fundamental physical and chemical mechanisms of wafer or MEMS processes.
  • Strong written and spoken communication skills.
  • Demonstrated leadership, teamwork/interpersonal, communication and technical skills.
  • Ability to creatively solve problems in a fast-paced product development environment

Visit the internship posting to learn more about the company, internship opportunity and qualifications.

How to Apply

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Job Categories: Chemical Engineering and Inorganic Chemistry. Job Types: Internship. Job expires in 59 days.

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